1. Strict and standardized 100% IQC incoming material inspection, and resist receiving defective materials
2. Material baking: bake components such as humidity sensitive devices and PCB in strict accordance with the requirements before production
3. X-ray counting machine reduces material damage caused by manual disassembly of materials
4. Gluing board: test the mounting position is correct or not , greatly reduce the time waste of SMT trial production，save the components, and effectively ensure the quality of SMT process
5. The intelligent first piece detector can be matched with the BOM list. It is mainly used for the first article detection. It can automatically judge and record the device parameters used by each new product, ensure that the use of materials is 100% correct, and detect wrong components, missing parts, polarity, direction, silk screen printing, etc; Compared with manual detection, the accuracy is higher and the speed is increased by more than 50%
6. 7 SMT lines are uniformly equipped with SPI (3D solder paste tester) to ensure that SMT process solder paste coating meets industrial standards. Detect various solder paste printing quality problems such as missing printing, missing solder, solder insufficient, solder bridge, wrong polarity wrong parts and so on
7、S12 temperature zone lead-free double track hot air reflow soldering oven + kic9 channel furnace temperature tester can achieve better temperature uniformity and heating power, so that different kinds of components can be reliably pasted on multi-layer PCB
8、8. Online AOI+ off-line AOI optical detector check each solder dots 100% : detects various problems after mounting: short circuit, components missing, polarity, displacement and wrong parts
9. X-ray: open circuit and short circuit detection for BGA, QFN and other packaging devices that cannot be directly observed