7 Automatic SMT production lines
A single product can be produced on the
machine with 360 kinds of components
（8mm
tapes）at the same time
15,320,000 soldering dots per day
100% inspection shall be carried out for each
solder spot to desist from failure
situation
such as open soldering, empty soldering,
inveracious soldering and
false soldering, etc
SMT (surface mount) processing is equipped with 7 new high-end automatic production lines.
Three high-speed lines and four medium speed lines are configured to deal with small and medium-sized batch order and mass production more flexibly.
Support the production of up to 360 kinds of materials at the same time, and the production capacity is 15.32 million soldering dots per day.
The equipment models of the whole line are unified, and the direct switching procedure from sample order to mass production reduces multiple manual programming operations, which is convenient for rapid production.
7 lines are uniformly equipped with SPI (3D solder paste tester) to ensure that SMT process solder paste coating meets industrial standards.
The solder paste adopts imported RoHS brand with 3.0 silver content and lead-free.
S12 temperature zone lead-free double track hot air reflow soldering + kic9 channel furnace temperature tester transmits the data to the receiver in real time through wireless transmission, and draws the furnace temperature curve through software to ensure the effective and accurate real-time welding temperature of the product and the welding reliability of the product.
Online + offline AOI optical detector shall 100% inspect each welding spot to eliminate wrong, missing, reverse, short, false, vertical, empty welding and other defects.
X-ray is used to inspect packaging devices that cannot be directly observed, such as BGA and QFN.
The first article tester can match with the BOM list to automatically judge and record the device parameters of each switching and new products, so as to ensure 100% correctness.
Please click the question to get the answer.
Surface Mount Technology (SMT) is a process where electronic components are mounted directly onto the surface of a PCB. It enables high-density design, fast production, and automated manufacturing, making it the standard in modern electronics assembly.
The typical SMT process includes: Solder paste printing → Component placement → Reflow soldering → AOI inspection → Functional testing (if required). Additional steps such as X-ray inspection or conformal coating may be applied depending on product requirements.
To start SMT manufacturing, customers usually provide:
Common issues include solder bridging, cold joints, component misalignment, and tombstoning. These are typically caused by design, stencil, or process parameter issues and can be minimized through proper engineering control.
SMT quality is ensured through DFM review, precise solder paste printing, automated placement, optimized reflow profiles, and inspection methods such as AOI and X-ray.
Yes. SMT is highly flexible and supports prototype builds, NPI projects, and low-to-medium volume production with fast turnaround.
Let the products quickly and stably realize marketization and become the global electronic intelligence innovation enabler
2026-05-13
